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The global semiconductor manufacturing equipment market size was valued at USD 88.2 billion in 2021 and is projected to grow from USD 101.6 billion in 2022 to USD 196.7 billion by 2029, exhibiting a CAGR of 9.9% during the forecast period. The Asia Pacific dominated the semiconductor manufacturing equipment market with a share of 65.87% in 2021.

The competitive landscape of the semiconductor manufacturing equipment market is determined by evaluating the major industry participants, production capacity, production capacity utilization rate, semiconductor manufacturing equipment market's production chain, pricing by each manufacturer, and revenue generated by each manufacturer in the global semiconductor manufacturing equipment market.

Top key players of semiconductor manufacturing equipment market:

• Applied Materials Inc (U.S.)
• Tokyo Electron Limited (Japan)
• Lam Research Corporation (U.S.)
• ASML (Netherlands)
• Dainippon Screen Group (Japan)
• KLA Corporation (Netherlands)
• Ferrotec Holdings Corporation (Japan)
• Hitachi High-Technologies Corporation (Japan)
• ASM International (U.S.)
• Canon Machinery Inc (Japan)

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Drivers and restraints:

Technological advancements in semiconductor manufacturing have become a key driver for industry growth. The continuous development of more efficient and precise tools has increased the demand for advanced manufacturing equipment. The surge in consumer electronics, particularly smartphones and smart devices, further accelerates this demand, as these products require semiconductors for their functionality. Additionally, the expansion of 5G technology has created a significant need for more sophisticated semiconductors, leading to heightened investment in cutting-edge manufacturing equipment.

However, the industry faces several challenges. The high capital investment required for purchasing and maintaining semiconductor manufacturing equipment serves as a substantial barrier, particularly for new market entrants and smaller companies. Moreover, global supply chain disruptions, compounded by geopolitical tensions, can cause shortages and delays in securing critical components, disrupting production timelines and impeding the industry's growth.

Regional analysis:

• North America (Equipment Type, Dimension, Application, and Country)
  • U.S. (By Equipment Type)
  • Canada (By Equipment Type)
  • Mexico (By Equipment Type)
• Europe (Equipment Type, Dimension, Application, and Country)
  • Germany (By Equipment Type)
  • U.K. (By Equipment Type)
  • France (By Equipment Type)
  • Italy (By Equipment Type)
  • Rest of Europe
• Asia Pacific (Equipment Type, Dimension, Application, and Country)
  • China (By Equipment Type)
  • India (By Equipment Type)
  • Japan (By Equipment Type)
  • South Korea (By Equipment Type)
  • Taiwan (By Equipment Type)
  • Rest of Asia Pacific
• Middle East and Africa (Equipment Type, Dimension, Application, and Country)
  • GCC Countries (By Equipment Type)
  • South Africa (By Equipment Type)
  • Rest of Middle East and Africa
• South America (Equipment Type, Dimension, Application, and Country)
  • Brazil (By Equipment Type)
  • Argentina (By Equipment Type)
  • Rest of South America

• Introduction
  • Research Scope
  • Market Segmentation
  • Research Methodology
  • Definitions and Assumptions
• Executive Summary
• Market Dynamics
  • Market Drivers
  • Market Restraints
  • Market Opportunities
• Key Insights
  • Key Industry Developments – Merger, Acquisitions, and Partnerships
  • Porter’s Five Forces Analysis
  • SWOT Analysis
  • Technological Developments
  • Value Chain Analysis

TOC Continued…!

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Key industry developments:

• Applied Materials Inc launched an optical semiconductor inspection machine using advanced technologies such as Artificial Intelligence (AI) and Big Data. These machines are used in semiconductor manufacturing plants to automatically inspect chips and detect killer defects in IC chips. These chips are used for electronics devices.
• Hitachi High-Tech Corporation, a subsidiary of Hitachi, introduced the new GS1000 electron beam area inspection system. The machine provides precise and quick inspection through the use of a common platform with high-speed inspection systems with Scanning Electron Microscope (SEM). Further, the machine improves the accuracy of semiconductor wafer products.
• Advantest Corporation acquired R&D Altanova Inc, which deals in discrete devices, silicon wafers, substrates, for interface boards for electronics sectors. The acquisition was done for improving the portfolio of these products across multiple sectors.
• Tokyo Seimitsu Co Ltd launched the new “SURFCOM NEX” contour measuring instrument. These machines have features such as high efficiency, high precision, high accuracy, and high reliability. It performs 1.6 times as per conventional measurement machines.
• KLA Corporation launched a series of wafer geometry machines such as SP7Xp wafer and PWG5TM. These machines are designed for minimizing the challenges in the manufacturing of semiconductor chips and discrete devices. These machines are used in manufacturing of cutting edge logic circuits. These chips are integrated into the automotive and electronics industries.

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Key questions are answer in this report:

• What is the size of the semiconductor manufacturing equipment market in 2024.
• Who are the key players in this report?
• What are the key drivers in the semiconductor manufacturing equipment industry?
• What are the future projections for the semiconductor manufacturing equipment industry?